X-ray tomography can show the inner structure of electronic components, thus performing non-destructive test for the sealed sample is the biggest advantage of this equipment. For the third generation semiconductor device, large scale integrated circuit, and quantum device, this technology is the best choice. Engineers in Sanying Precison have abundant experience in quality evaluation of PCB/PCBA and failure analysis. For the special problem, we have ability to provide the targeted solutions for the researchers.
PCB: non-wetting, layering, open and short circuit;
PCBA: non-wetting, solder joint cracking, missing part, component failure, corrosion;
PCB test and evaluation: 3D morphology analysis, measurement of inner structure.